Multilayer

Ever-smaller components with increasing cycle frequencies demand impedance controlled conductors, EMC and signal integrity. Multilayer technology facilitates the separation of analogue and digital parts on a PCB.

The main challenge posed by multilayer PCBs emanates from the optimum handling of the extremely thin material layers. Häusermann has overcome this problem by predominantly automated production procedures.

Our ideally designed registration processes guarantee the maximum cover uniformity of all layers, including those with the finest structures.

• Multilayer PCBs with up to 18 layers
  
• Thicknesses of 0.8 - 2.6mm
  
• Impedance calculations for multilayers

Materials and copper lamination

• FR4, Tg 135°C
  
• FR4, Tg 150°C

• Copper thicknesses for outer layers: 35 - 140µm
  
• Copper thicknesses for inner layers: 18 - 105µm